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JANUARY 2004; VOL. 4, NO. 1
TEXT-ONLY VERSION |
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 LTCC RF Modules
Low-temperature-co-fired-ceramic (LTCC) technology offers the means to integrate active and passive components on compact modules for both commercial and military applications. This elegant technology can provide tremendous benefits in terms of high performance and small size but requires careful design discipline to achieve repeatable results. A novel procedure using Ansoft Designer allows passive and active modules, such as power amplifiers (PAs), radio frequency (RF) switches, and RF front-ends, to be designed quickly and easily on LTCC substrates. Read more about this in the September 2003 issue of Microwaves & RF. |
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1. Announcing 2004 HFSS™ Users Workshop and Call for Presentations
Ansoft’s 2004 HFSS Users Workshop Series will take place in Los Angeles on February 19-20 and in Boston on February 24. These free workshops will give Ansoft customers an excellent opportunity to meet with each other and with Ansoft’s technical staff to discuss ideas and applications related to HFSS. For specific venues and information on how to submit a brief abstract for presentation, click here. |
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2. ePhysics™ Adds Coupled Thermal and Stress Analysis to HFSS™
Ansoft’s ePhysics is new software that expands the capabilities of HFSS to couple high-frequency electromagnetic analysis with three-dimensional thermal and stress analyses. HFSS with ePhysics is vital for applications such as high-power microwave devices, military and broadcast communications, antennas, arrays, packaging, and biological heating with RF sources. For details, click here. |
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3. HFSS™ Used in UMC’s Breakthrough RFCMOS Design Methodology
UMC, a leading semiconductor foundry, recently announced a breakthrough Electromagnetic Design Methodology (EMDM) for RFCMOS designs. This new methodology applies electromagnetic (EM) analysis tools to replace very expensive and highly time-consuming physical prototypes with EM-based virtual prototypes. UMC has extensively validated the success of this EMDM for RFCMOS designs through the fabrication and measurement of hundreds of components. UMC’s EMDM, which utilizes Ansoft’s HFSS™ 3D simulation software, allows engineers to easily and accurately create RF structures, such as spiral inductors, in their design without going through several wafer splits and the painful tasks of measurement, data fitting, and modeling. To read more, click here. |
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4. Taiyo Yuden Releases RF Component Library for Ansoft Designer™
Ansoft and Taiyo Yuden recently announced the release of a new device library for Ansoft Designer v1.1 based on Taiyo Yuden® high-density miniaturized surface-mount components. The component library will help engineers designing electronic equipment, such as Wireless Local Area Networks (WLANs), car navigation systems, base stations, and cellular handsets, by providing accurate electrical responses and mechanical layout features for manufacturing. To learn more, click here. |
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5. Ansoft 2003 Global Seminars Wrap Up
Leading technology companies worldwide showcased their innovative high-frequency and high-speed design methods at Ansoft’s 2003 Delivering Performance Global Seminar Series. The seminars included presentations from many of today’s leading high-tech companies, including Raytheon, Motorola, UMC, Molex, and others. To download presentations, click here. |
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| 6. Current Events and Training |
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HF/SI News & Events is electronically distributed every other month, then posted on our Web site here. If you know someone who would like to receive it, please distribute this email.
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