FIND OUT MORE ON JUNE 7–10 BY VISITING ANSOFT AT DAC, BOOTH 945.
 As a leading provider of circuit-simulation and analysis software, we understand that high-performance IC and system design engineers expect nothing less than a complete integrated software solution that accelerates the design flow and speeds time-to-market.
Just ask our customers. Whether they’re designing RFCMOS ICs, IC packages, or wireless RF transceivers, they realize that Ansoft’s technology gives them a distinct competitive advantage.
To see how some of them are using our products, stop by Booth 945 at this year’s Design Automation Conference for the following partner presentations:
IN-BOOTH DESIGN WORKSHOP PRESENTATIONS ON JUNE 7 AND 8*
- UMC’s Breakthrough RFCMOS Design Methodology for High-Performance ICs
Alfred H. C. Tseng, RF Manager, MM&RF Dept., Central R&D Division
UMC
- Behavioral Design of Fractional-N Synthesizer ICs for Secured Wireless Communications
Bill Martin, Distinguished Member of Technical Staff, Motorola CGISS Division
Motorola
- 10Gb/s Serial Channel Backplane Design Based on Xilinx Virtex-II Pro X™
Suresh Subramaniam, Sr. Design Engineer, Systems Engineering Group, Advanced Products Division
Xilinx
- High-Performance IC Package Design and Analysis
Kevin Rinebold, Sr. Technical Marketing Manager, Advanced Packaging Products
Synopsys
While at the booth, you’ll witness the debut of Nexxim™—the next state of the art in circuit simulation—and see how the latest versions of HFSS™, Q3D Extractor™, and Ansoft Designer™ integrate to revolutionize IC, package, and board design. Watch any of the presentations, and we’ll enter you to win a Lexar® Media 256MB JumpDrive® 2.0 Pro USB Flash Drive. Note: You must remain for the full presentation to be eligible for the drawing.
*For a complete schedule and to register »
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