KYOCERA AMERICA San Diego, CA Electronic Packaging Web Site

Kyocera America designs, manufactures, and assembles a broad range of electronic packaging solutions for the telecommunications and semiconductor markets based on advanced ceramic and plastic material technologies. Its products and services support broadband, mobile and satellite communications, surveillance systems, sensors, automotive electronics, medical devices, computers, and consumer electronics. THE NEED To design a high-density, high-performance, OC-768 package fast and accurately THE SOLUTION HFSS™, Full-Wave Spice™ "HFSS is a powerful electromagnetic tool for modeling ceramic packages,” said Joseph Tallo, Kyocera America Inc. “It is absolutely necessary in the packaging world." According to Tallo, Ansoft simulations enable: The design of an interconnect over a required bandwidth The characterization of transitions The extraction of circuit models Kyocera to provide its customers with the best technology for each application « Back to Preview Front Page